半导体基板、封装与装置

Abstract

一种半导体基板被公开,该半导体基板包括载体、第一导电层与第二导电层。载体具有第一表面、第二表面以及用以容置半导体元件的凹部。第一导电层埋设在第一表面中,并形成多个电隔离的封装走线。第二导电层埋设在第二表面中,并与第一导电层电连接。半导体基板可以应用于半导体封装,用于容纳半导体芯片,且半导体基板与用于固定该芯片的填充结构结合。此外,多个半导体基板可以被堆叠且通过粘结层连接,以便形成具有复杂结构的半导体装置。

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